Clean Room Assembly and Test

Clean Room Assembly and Test

Sub-contract assembly is carried out at Shropshire Precision’s dedicated facility. The company assures a high level of cleanliness and precision during the assembly process which is carried out to semiconductor industry standards.

Advanced technologies are used to precisely assemble and test assemblies to exacting customer requirements. Shropshire Precision have forged long term partnerships with semiconductor clients, and in many cases are the sole supplier for advanced technology used in ion beam and wafer manufacture.

Applications

• Project managed final and sub-assembly capability with cleanroom facility.
• In-house manufacture and closely managed outsourcing.
• Ultrasonic cleaning.
• Helium leak testing and pressure testing. Electrical test. Heat cycling under UHV conditions.